Mitarbeiterseite

2017
Esfandyari, A.; Sattler, D.; Syed-Khaja, A.; Franke, J.: A Lean-Based Key Performance Analysis for a Resource Efficient Soldering Oven in Electronics Production. In: Jörg Franke; Sven Kreitlein (Hrsg.): Energy Efficiency in Strategy of Sustainable Production Vol. II. Pfaffikon: Trans Tech Publications Ltd, 2017, S. 91--98

Syed-Khaja, A.; Stecher, J.; Esfandyari, A.; Kreitlein, S.; Franke, J.: Efficient and Noise Reduced Design of Axial Fans Considering Psychoacoustic Evaluation Criteria. In: Jörg Franke; Sven Kreitlein (Hrsg.): Energy Efficiency in Strategy of Sustainable Production Vol. II. Pfaffikon: Trans Tech Publications Ltd, 2017, S. 188--194

2016
Syed-Khaja, A.; Scherzer, S.; Daoud, H.; Pfarr, J.; Loidolt, A.; Chadda, A.; Franke, J.: Process Optimization in Transient Liquid Phase Soldering (TLPS) for an Efficient and Economical Production of High Temperature Power electronics. In: VDE-Verlag (Hrsg.): Integrated Power Systems (CIPS), 2016 9th International Conference on. Berlin-Offenbach: VDE-Verlag, 2016, S. 1--6

Syed-Khaja, A.; Perez, P.; Franke, J.: Production and characterization of high-temperature substrates through selective laser melting (SLM) for power electronics. In: IEEE (Hrsg.): 2016 IEEE CPMT Symposium Japan (ICSJ). 2016, S. 255--258

Syed-Khaja, A.; Klemm, A.; Zerna, T.; Franke, J.: Characterization and Optimization of Sn-Cu TLPS Interconnects for High Temperature Power Electronics through In-Situ-X-Ray Investigations: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). In: IEEE CPMT Society (Hrsg.): Proceedings of 66th Electronic Components and Technology Conference. Piscataway,; New; Jersey: IEEE, 2016

Kaestle, C.; Syed-Khaja, A.; Franke, J.: Investigations on Wire Bonding Capability of Selective Laser Melted Structures. In: International Microelectronics Assembly and Packaging Society (Hrsg.): Proceedings of the 49th International Symposium on Microelectronics (IMAPS). Pasadena,; CA: International Microelectronics Assembly and Packaging Society, 2016, S. 209--213

Esfandyari, A.; Bachy, B.; Raithel, S.; Syed-Khaja, A.; Franke, J.: Simulation, Optimization and Experimental Verification of the Over pressure Reflow Soldering Process. In: 10th CIRP Conference on Intelligent Computation in Manufacturing Engineering - CIRP ICME '16. 2016

Hamilton, D.; Syed-Khaja, A.; Franke, J.; Mawby, P.: High temperature thermal cycling reliability of silver sintered and electroplated transient liquid phase joints. In: VDE-Verlag (Hrsg.): Integrated Power Systems (CIPS), 2016 9th International Conference on. Berlin-Offenbach: VDE-Verlag, 2016, S. 1--6

Syed-Khaja, A.; Franke, J.: Innovative Approach in the Production of Ceramic Circuit Carriers for High-temperature Electronics through Selective Laser Melting. In: Gerd Prof. Dr. Witt (Hrsg.): Rapid.Tech 2016 -- International Trade Show &Conference for Additive Manufacturing: Proceedings of the 13th Rapid.Tech Conference. München: Carl Hanser Verlag München, 2016

Syed-Khaja, A.; Stoll, T.; Franke, J.: Investigations in selective laser melting as manufacturing technology for the production of high-temperature mechatronic integrated devices. In: IEEE (Hrsg.): 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). 2016

Syed-Khaja, A.; Franke, J.: Potentiale der additiven Fertigung in der Elektronikproduktion mittels SLM Technologie. In: IMAPS-Frühjahrseminar 2016. 2016

Syed-Khaja, A.; Franke, J.: Selective Laser Melting for Additive Manufacturing of High-Temperature Ceramic Circuit Carriers: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). In: IEEE CPMT Society (Hrsg.): Proceedings of 66th Electronic Components and Technology Conference. Piscataway,; New; Jersey: IEEE, 2016

Syed-Khaja, A.; Kaestle, C.; Franke, J.: Feasibility Studies on Selective Laser Melting of Copper Powders for the Development of High-temperature Circuit Carriers. In: International Microelectronics Assembly and Packaging Society (Hrsg.): Proceedings of the 49th International Symposium on Microelectronics (IMAPS). Pasadena,; CA: International Microelectronics Assembly and Packaging Society, 2016, S. 517--522

Syed-Khaja, A.; Walawski, D.; Stoll, T.; Franke, J.: Is selective laser melting (SLM) an alternative for high-temperature mechatronic integrated devices? methodology, hurdles and prospects. In: Jörg Franke (Hrsg.): 2016 12th International Congress Molded Interconnect Devices (MID): Scientific proceedings : September 28th-29th, 2016, Würzburg, Germany. Nuremberg; Nuremberg: Research Association Molded Interconnect Devices 3-D MID e.V, 2016, S. 1--5

2015
Kreitlein, S.; Eder, N.; Syed-Khaja, A.; Franke, J.: Comprehensive Assessment of Energy Efficiency within the Production Process. In: World Academy of Science, Engineering and Technology International Journal of Mechanical, Aerospace, Industrial, Mechatronic and Manufacturing Engineering 9 (2015), Nr. 7, S. 1318--1325

Esfandyari, A.; Syed-Khaja, A.; Horvath, M.; Franke, J.: Energy Efficiency Analysis of Vapor Phase Soldering Technology through Exergy-based Metric. In: Jörg Franke; Sven Kreitlein (Hrsg.): Energy Effiency in Strategy of Sustainable Production. Pfaffikon: Trans Tech Publications Ltd, 2015, S. 196--204

Syed-Khaja, A.; Schwarz, D.; Franke, J.: Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications. In: 2015 IEEE CPMT Symposium Japan (ICSJ). 2015, S. 156--159

Syed-Khaja, A.; Schramm, R.; Ochs, R.; Franke, J.: Investigations in the Optimization of Power Electronics Packaging through Additive Plasma Technology: CIRPe 2015 - Understanding the life cycle implications of manufacturing. In: Elsevier Science Publishers (Hrsg.): CIRPe 2015 - Understanding the life cycle implications of manufacturing. 2015 (37), S. 59--64

Syed-Khaja, A.; Hörber, J.; Gruber, C.; Franke, J.: A Novel Approach for Thin-Film Ag-Sintering Process Through Aerosol-Jet Printing in Power Electronics: Friedrichshafen, Germany. In: EMPC 2015 - European Microelectronics Packaging Conference: The Winding Roads of Electronics Packaging. 2015, S. 1--6

Syed-Khaja, A.; Franke, J.: Characterization and Reliability of Paste Based Thin-Film Sn-Cu TLPS Joints for High Temperature Power Electronics: PCIM Europe 2015; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of. In: PCIM. 2015, S. 1--7

Syed-Khaja, A.; Daoud, H.; Edyta, S.; Chadda, A.; Franke, J.: Preform based Diffusion Soldering Technology for SiC/GaN Devices for Usage at High Temperatures. In: PCIM. 2015

Syed-Khaja, A.; Franke, J.: Influential parameters in the development of Transient Liquid Phase Soldering (TLPS) as a new interconnect system for high power lighting applications. In: 2015 IEEE CPMT Symposium Japan (ICSJ). 2015, S. 152--155

2014
Müller, M.; Syed-Khaja, A.; Franke, J.: Zuverlässige Lötverbindungstechnologien für Hochtemperaturanwendungen in der Leistungselektronik. In: Fachverband Elektronik-Design e.V. (Hrsg.): 22. FED-Konferenz 2014: Elektronik-Design-Leiterplatten-Baugruppen. Berlin: 2014, S. 225--234

Syed-Khaja, A.; Franke, J.: Design and Solder Process Optimization in MID Technology for High Power Applications: MID Kongress 2014. In: Advanced materials Research (2014), Nr. 1038, S. 107--112

Syed-Khaja, A.; Franke, J.: Investigations on advanced soldering mechanisms for transient liquid phase soldering (TLPS) in power electronics: Electronics System-Integration Technology Conference (ESTC), 2014. In: Electronics System-Integration Technology Conference (ESTC), 2014. 2014, S. 1--7

Esfandyari, A.; Syed-Khaja, A.; Javied, T.; Franke, J.: Energy Efficiency Investigation on High-Pressure Convection Reflow Soldering in Electronics Production. In: Jörg Franke; Sven Kreitlein (Hrsg.): Green Factory Bavaria Colloquium 2014. Switzerland: Trans Tech Publications Ltd, 2014, S. 95--100

2013
Syed-Khaja, A.; Kästle, C.; Reinhardt, A.; Franke, J.: Optimized thin-film diffusion soldering for power-electronics production. In: IEEE (Hrsg.): Proceedings of the 36th International Spring Seminar on Electronics Technology (ISSE). 2013, S. 11--16

Kästle, C.; Syed-Khaja, A.; Reinhardt, A.; Franke, J.: Investigations on Ultrasonic Copper Wire Wedge Bonding for Power Electronics. In: IEEE (Hrsg.): Proceedings of the 36th International Spring Seminar on Electronics Technology (ISSE). 2013, S. 79--84

Kästle, C.; Syed-Khaja, A.; Franke, J.: Zuverlässige Verbindungstechnologien für die Leistungselektronik: Diffusionslöten und Kupfer-Dickdrahtbonden. In: Deutsche IMAPS-Konferenz: Herbstkonferenz. 2013

Syed-Khaja, A.; Kästle, C.; Franke, J.: Reliable packaging technologies for power electronics: Diffusion soldering and heavy copper wire bonding. In: Jörg Franke (Hrsg.): 3rd International Electric Drives Production Conference: Proceedings. Piscataway,; NJ: IEEE, 2013, S. 498--503